SEMICON Japan Virtual [Date: December 14, 2020 (Monday) -December 17, 2020 (Thursday)]

<December 8, 2020  Event information>

We will exhibit at SEMICON Japan Virtual, which will be held from December 14th (Monday).
It is an online event that you can participate in anytime, anywhere.
We　have proposals of grinding process to leap to a new stage with customers
We are looking forward to your visit.

Click here for pre-registration ↓

https://www.semiconjapan.org/en/about/pricing-and-register

 

SEMICON Japan Virtual Official Website

https://www.semiconjapan.org/en

 

【Exhibition outline】

December 14, 2020 (Monday) 10:00 to 17 (Thursday) 17:00

【Highlight】

・For SiC wafer grinding “NEW”  vitrifided diamond wheels (for rough grinding)
Contributes to improved productivity by achieving both high sharpness and long-life.

・For SiC wafer grinding vitrifided diamond wheels (for finish grinding)
A wheel manufactured by an innovative manufacturing method that distributes ultrafine diamonds unifoemly
and it contributes to high-precision grinding.

 

・Jigs for semiconductor manufacturing equipment  “NEW” resinoid bond wheels for ultra-precision grinding Teramate series
In low thermal expansion glass used in lenses such as exposure equipments
We propose no lapping process by our innovative technology.

・Resinoid bond wheels to grind jigs for semiconductor manufacturing equipment “Teramate” series
contributes to improved prodoctivity by achieving outstanding sharpness in various ceramic materials.