JTEKT Grinding Tool Co., Ltd., together with JTEKT Group companies,

will exhibit at SEMICON Japan 2022 to be held at Tokyo Big Sight on December 14 (Wed.) ~ December 16 (Fri.), 2022.

 

Venue: Tokyo Big Sight (Tokyo International Exhibition Center)

Exhibition Hall: East Exhibition Hall 2

Booth:2141

 

●Introduction of exhibited products

【Semiconductor wafer field】

Vitrified diamond wheel for SiC wafer grinding “nanoVi”

 

【Semiconductor jigs】

Newly developed resin diamond wheel for grinding hard brittle materials “Revomate”

 

▽Please pre-register from the link below. ▽

Pre-registration link

 

More information will be available soon on our membership site.

Member Site URL

 

We sincerely look forward to your visit.