Wafers for surface grinding「nanoVi®」
nanoVi®
・Rough grinding wheel contributes to reduced tool costs by improving abrasion resistance
・Finishing grinding wheel realizes consistent wafer processing quality with stable cutting ability
| Applications | Surface Grinding for Semiconductor Wafers |
|---|---|
| Bond Type | Vitrified Bond |
Uniform wheel structure
• Stable cutting ability
• Stable processing quality
Glass binder with high strength
• Suppression of wheel wear
For more detailed information on the product features, please download the product documentation.
■Rough Grinding: Extended Tool Life
…Improved wear resistance achieved through a high-strength glass bond significantly reduces the wear rate.
This wheel can achieve 12% wear rate on 8-inch SiC wafers with laser-sliced surfaces.
■Finish Grinding: Stable Processing Quality
This wheel can provide stable surface quality even with continuous grinding on 8-inch SiC wafers.
